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Stability of gold thin films on polyimide

Show simple item record Amoako, G. Mensah, S. Y. Twum, A. Teye, V. D. 2021-10-28T11:35:20Z 2021-10-28T11:35:20Z 2011
dc.identifier.issn 23105496
dc.description 7p:, ill. en_US
dc.description.abstract Gold/Polyimide interfaces are prepared by depositing thin gold films onto polyimide with Si substrates and subsequently annealing at various temperatures. The interface is studied with the help of Rutherford backscattering spectroscopy. After deposition, different sample thicknesses exhibited different morphologies. High deposition rates resulted in the formation of gold islands. After annealing at higher temperatures polyimide covered the sample surface. Chromium was also used as a buffer between gold/polyimide interface to increase adhesion and possibly to decrease the tendency of gold to form islands and also to stop polyimide from covering the gold surface. To reduce the mobility of metal atoms, a gold film is prepared at -68 0 C en_US
dc.language.iso en en_US
dc.publisher University of Cape Coast en_US
dc.subject Adhesion en_US
dc.subject Anneal en_US
dc.subject In-diffusion en_US
dc.subject Metal en_US
dc.subject Mobility en_US
dc.subject Morphology en_US
dc.title Stability of gold thin films on polyimide en_US
dc.type Article en_US

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