Stability of gold thin films on polyimide

dc.contributor.author	Amoako, G.
dc.contributor.author	Mensah, S. Y.
dc.contributor.author	Twum, A.
dc.contributor.author	Teye, V. D.
dc.date.accessioned	2021-10-28T11:35:20Z
dc.date.available	2021-10-28T11:35:20Z
dc.date.issued	2011
dc.identifier.issn	23105496
dc.identifier.uri	http://hdl.handle.net/123456789/6301
dc.description	7p:, ill.	en_US
dc.description.abstract	Gold/Polyimide interfaces are prepared by depositing thin gold films onto polyimide with Si substrates and subsequently annealing at various temperatures. The interface is studied with the help of Rutherford backscattering spectroscopy. After deposition, different sample thicknesses exhibited different morphologies. High deposition rates resulted in the formation of gold islands. After annealing at higher temperatures polyimide covered the sample surface. Chromium was also used as a buffer between gold/polyimide interface to increase adhesion and possibly to decrease the tendency of gold to form islands and also to stop polyimide from covering the gold surface. To reduce the mobility of metal atoms, a gold film is prepared at -68 0 C	en_US
dc.language.iso	en	en_US
dc.publisher	University of Cape Coast	en_US
dc.subject	Adhesion	en_US
dc.subject	Anneal	en_US
dc.subject	In-diffusion	en_US
dc.subject	Metal	en_US
dc.subject	Mobility	en_US
dc.subject	Morphology	en_US
dc.title	Stability of gold thin films on polyimide	en_US
dc.type	Article	en_US